Binding: Hardcover
Description: Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality authenticity or access to any online entitlements included with the product. Proven processes for ensuring semiconductor device reliability Co - written by experts in the field Semiconductor Process Reliability in Practice contains detailed descriptions and analyses of reliability and qualification for semiconductor device manufacturing and discusses the underlying physics and theory. The book covers initial specification definition test structure design analysis of test structure data and final qualification of the process. Real - world examples of test structure designs to qualify front - end - of - line devices and back - end - of - line interconnects are provided in this practical comprehensive guide. Coverage includes: Basic device physics Process flow for MOS manufacturing Measurements useful for device reliability characterization Hot carrier injection Gate - oxide integrity (GOI) and time - dependentdielectric breakdown (TDDB) Negative bias temperature instability Plasma - induced damage Electrostatic discharge protection of integrated circuits Electromigration Stress migration Intermetal dielectric breakdown
Title: Semiconductor Process Reliability In Practice
Author(s): Liou Juin
Publisher: Mcgraw - Hill Education - Europe
Barcode: 9780071754279
Pages: 624 Pages, 200 Illustrations, Unspecified
Publication Date: 10/31/2012
Category: Communications Engineering / Telecommunications